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The new solution for integration in intelligent building system  ( CPCI-S收录)  

文献类型:会议论文

英文题名:The new solution for integration in intelligent building system

作者:Fan, Tongshun[1];Su, Wei[1];Du, Mingfang[1];Yang, Xiaoling[1]

第一作者:Fan, Tongshun

机构:[1]Beijing Union Univ, Automat Coll, Beijing 100101, Peoples R China

第一机构:北京联合大学城市轨道交通与物流学院

会议论文集:Xian International Conference on Architecture and Technology

会议日期:SEP 23-25, 2006

会议地点:Xian, PEOPLES R CHINA

语种:英文

外文关键词:system integration; IBMS; network; protocol

摘要:This paper explains the different layers of integration system in intelligent building and analyses characteristics and problems of four existing integration modules, i.e. direct connecting integration, central platform of BAS integration, parallel subsystem integration and integration based on LonMark and BACnet. Two new solutions of parallel integration module and OPC componential integration module are presented. The core idea of parallel integration module is that BMS network is divided into management network and monitor network with its subsystems running in monitoring network and system integration database running in management network. The integration of each subsystem and management network can be divided into two types according to the additional application program. The first one is to realize integration through industrial standard protocol. Another one is to develop gateway software by using application program of API/Net API function provided by system to ensure access to database when both communication sides do not have one standard protocol interface. The core idea of OPC componential integration module is to develop an OPC server running between central monitoring and control station of BMS and each subsystem to ensure the same standard OPC being used by OPC server and OPC client and direct intercommunication.

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