文献类型：期刊文献

英文题名：TEM and EBSD characterization revealing the recrystallization process occurring in the Sn-3.0Ag-0.5Cu Ball Grid Array solder joints during thermal cycling

作者：Du, Yihui[1];Wang, Yishu[1];Ji, Xiaoliang[1];Tan, Shihai[1];Han, Jing[1];Guo, Fu[1,2,3]

第一作者：Du, Yihui

通讯作者：Guo, F[1]

机构：[1]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China;[2]Beijing Univ Technol, Key Lab Adv Funct Mat, Educ Minist China, Beijing 100124, Peoples R China;[3]Beijing Union Univ, Coll Robot, Beijing 100101, Peoples R China

第一机构：Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China

通讯机构：[1]corresponding author), Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China.

年份：2023

卷号：200

外文期刊名：MATERIALS CHARACTERIZATION

收录：;EI(收录号：20231513863189);Scopus(收录号：2-s2.0-85151670458);WOS:【SCI-EXPANDED(收录号:WOS:000981405700001)】；

基金：The authors would like to appreciate the support of the Innovative Research Group Project of National Natural Science Foundation of China (51621003), National Natural Science Foundation of China (52001013) and Postdoctoral Research Foundation of China (2022 M710271). The authors are grateful for their financial support.

语种：英文

外文关键词：SAC305; Thermal cycling; Sub -grain boundary; Recrystallization; HRTEM

摘要：We reported a phenomenon and mechanism of recrystallization evolution in solder joint under thermomechanical stress. Ball Grid Array samples fabricated by Sn3.0Ag0.5Cu solder were placed into the thermal cycling test chamber with a temperature range of -55 degrees C to 125 degrees C. Characterized using electron backscattered diffraction technique, three stages of recrystallization occurring in the solder joint were found to co-exist in one joint after 2500 thermal cycles. To better understand the formation of recrystallized grains during thermal cycling, especially dislocation substructures at the early stage, thin foils corresponding to different stages of the recrystallization were extracted by focus ion beam from the solder joint and analyzed by high-resolution transmission electron microscope. We summarize the recrystallization process including the annihilation of dislocation dipoles contributes to the evolution of sub-grain boundaries, and then the recrystallized grains are generated by sub-grain rotation mechanism. In addition, the recrystallized grains proceed to the subsequent same cycle until the failure of solder joint. The study provides the theoretical basis and technical support for further improving the thermo-mechanical reliability of Sn-based lead-free solder joints.