文献类型：会议论文

英文题名：Research on Chip Cooling of High Power Density Integrated

作者：Wang, Shufang[1];Yang, Zhiyong[2];Xi, Wei[1]

第一作者：王淑芳

通讯作者：Wang, SF[1]

机构：[1]Beijing Union Univ, Sch Mech Elect, Beijing 100020, Peoples R China;[2]Astronaut Long March Rocket Technol Ltd Co, Beijing 100076, Peoples R China

第一机构：北京联合大学机器人学院

通讯机构：[1]corresponding author), Beijing Union Univ, Sch Mech Elect, Beijing 100020, Peoples R China.|[1141739]北京联合大学机器人学院;[11417]北京联合大学;

会议论文集：International Conference on Electrical, Mechanical and Industrial Engineering (ICEMIE)

会议日期：APR 24-25, 2016

会议地点：Phuket, THAILAND

语种：英文

外文关键词：micro-channel; integrated chip cooling; the numerical simulation; micro-fluidic

摘要：Increasingly, heat flux density on one chip reached to 1KW/cm(2) with the development of integration technology. However, it is hardly to meet the demand of 417K for conventional cooling way. Chip cooling become the bottleneck of integration further. This paper put forward that integrated micro channel in the chip, through which the micro fluid could transfer internal heat to the external. According to the actual working conditions, entrance flow speed and temperature could be adjusted to ensure the normal work of the chip. Firstly, analog chips model including unknown size micro channel was designed. Secondly, the ANYSIS software was adopted to find the proper size. Moreover, size 40 mu m micro channel could satisfy the high temperature on chip was 413K approximately. Furthermore, the situation of bi-direction flow, changed entrance velocity and entrance temperature was considered to reach the optimized result. It indicated that the chip cooling with micro-channel was feasible.