文献类型：期刊文献

英文题名：DESIGN OF A COOLING SYSTEM FOR MICROCHIPS WITH HIGH HEAT-FLUX DENSITY USING INTEGRATED MICROCHANNELS

作者：Wang, Shufang[1];Zhou, Debao[2];Yang, Zhiyong[3]

第一作者：王淑芳

通讯作者：Zhou, DB[1]

机构：[1]Beijing Union Univ, Coll Mech & Elect Engn, Beijing 100020, Peoples R China;[2]Univ Minnesota, Dept Mech & Ind Engn, Duluth, MN 55812 USA;[3]Astronaut Long March Rocket Technol Ltd Co, Beijing 100076, Peoples R China

第一机构：北京联合大学机器人学院

通讯机构：[1]corresponding author), Univ Minnesota, Dept Mech & Ind Engn, Duluth, MN 55812 USA.

年份：2017

卷号：48

期号：14

起止页码：1299-1312

外文期刊名：HEAT TRANSFER RESEARCH

收录：;EI(收录号：20174604392959);Scopus(收录号：2-s2.0-85033405153);WOS:【SCI-EXPANDED(收录号:WOS:000414342800004)】；

基金：The work described in this paper is supported by the Importation and Development of High-Caliber Talents Project of the Beijing Municipal Institutions and the Beijing Intelligent Machinery Innovation Design Service Engineering Technology Research Center.

语种：英文

外文关键词：microchannels; cooling system; microchips; microfluid; high heat-flux density

摘要：With the improvement of the integration technology, the heat-flux density in microchips has reached 1 kW/cm(2). Traditional cooling methods cannot control the temperature below 393 K as desired. Thus chip cooling has become the bottleneck for further integration. To ensure a normal working condition, this paper proposed to use a microfluid to discharge the internal heat, by making the fluid flow through the integrated microchannels in a chip. To realize this, the present work firstly focused on the design of the microchannels based on a desired model of a microchip. Secondly, to find the optimized size of the microchannels, numerical simulation was performed. It was found that the diameter of the microchannels at 40 mm could keep the chip temperature around 393 K. Further experiments have been performed to verify the numerical results. Both the numerical and experimental results have shown that the highest temperature of a chip can be controlled to as low as 370 K through combining and adjusting the bidirectional flow, entering velocity, and entering temperature. These results proved the feasibility of the chip cooling concept using microchannels.